Semiconductor companies Amkor Technology and STATS ChipPAC will each have about 40% of the packaging orders placed by Apple for its upcoming A8 processor, while Advanced Semiconductor Engineering (ASE) will have the remaining 20% of the orders, according to a new report by DigiTimes. Apple's A8 chip will be a package-on-package (PoP) SoC solution comprising processors … [Read more...] about Amkor, STATS ChipPAC, ASE to Share Backend Orders for Apple A8 Chip
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Samsung and TSMC to Share Orders for Smaller 14/16nm Apple A-Series Processors
Samsung and TSMC will share orders for smaller next generation Apple A-series processors. Samsung is said to have signed a contract to produce the processors for 2015 using a 14/16nm FinFET process. Samsung will use its 14nm FinFET process to manufacture a portion of the A-series chips for Apple's 2015 iPhone series, and the remainder of the chips will be built using TSMC's … [Read more...] about Samsung and TSMC to Share Orders for Smaller 14/16nm Apple A-Series Processors